MicroVision semiconductor unit targets LiDAR and ADAS

MicroVision has launched a dedicated semiconductor unit, MicroVision Semiconductor, expanding its in-house capabilities in custom application-specific integrated circuit (ASIC) development, mixed-signal integrated circuits, and photonic sensing. The Colorado Springs organisation, formerly Black Forest Engineering and acquired from Luminar, brings more than 30 years of semiconductor expertise to MicroVision’s growing LiDAR and perception portfolio.

The new organisation offers complete ASIC development services from concept through to production, covering mixed-signal and analogue design, high-performance readout integrated circuits, and radiation-hardened semiconductor designs across leading foundries including Tower Semiconductor, TSMC, and X-FAB. The team has produced more than 300 custom integrated circuit designs to date, a track record that supports both external customer contracts and MicroVision’s own perception hardware development.

In a statement, Glen DeVos, Chief Executive of MicroVision, said: “Semiconductors are becoming one of the most important differentiators in advanced perception systems. These capabilities accelerate our own product roadmap by enabling tighter integration between our sensors, electronics, and software.”

The launch is a central component of MicroVision’s LiDAR 2.0 strategy, which targets a move beyond standalone sensors toward fully integrated perception systems that combine hardware, semiconductors, photonics, and software across autonomous and industrial markets. In addition to advancing its own frequency-modulated continuous-wave LiDAR development through photonic integrated circuits, MicroVision Semiconductor will continue providing custom ASIC design services to an established external customer base across automotive, industrial, and defence sectors.

Why this matters:

  • In-house ASIC capability changes MicroVision’s competitive position.Lidar performance is increasingly determined at the semiconductor level—owning the custom chip design rather than sourcing externally gives MicroVision tighter integration between sensor, electronics, and software, and removes a dependency that has constrained differentiation for sensor manufacturers relying on third-party silicon.
  • Acquiring the capability from Luminar is as notable as the launch itself.Black Forest Engineering was part of Luminar’s vertical integration strategy; MicroVision acquiring it suggests Luminar’s broader restructuring has created opportunities for competitors to absorb assets that took years and significant capital to build.

AP by OMG

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Originally posted on: https://www.automotiveworld.com/news/microvision-semiconductor-unit-targets-lidar-and-adas/