Neusoft Smart Go and GigaDevice have entered an automotive chip partnership to jointly develop intelligent cockpit, central computing and zone-controller solutions for connected vehicles. The tie-up pairs GigaDevice’s automotive-grade chips with Neusoft Smart Go’s expertise in upper-body automotive electronics, as vehicle electrical architectures shift toward centralisation.

Under the agreement, GigaDevice’s automotive storage and microcontroller units will be adapted and deployed across Neusoft Smart Go’s in-vehicle product line. The two firms will also build a shared supply chain assurance system, combining GigaDevice’s manufacturing capacity with Neusoft Smart Go’s market access.

A third strand covers chip access testing and connecting suppliers across the automotive electronics value chain, as the pair support a wider intelligent vehicle ecosystem. GigaDevice has shipped more than 450 million automotive-grade flash chips to date, while Neusoft Smart Go, a Neusoft Corporation subsidiary, integrates large AI models into its cockpit platforms.

Jian Guodong, Senior Vice President of Neusoft Corporation and Chief Executive of Neusoft Smart Go, said the partnership would extend beyond conventional supply chain boundaries to deliver more competitive hardware-software solutions. Li Wenxiong, Vice President of GigaDevice and General Manager of its Automotive Business Unit, said the deal ties chip development to in-vehicle intelligent system platforms.

Source: Neusoft